Xiaoxiong (Kevin) Gu received his Ph.D. in Electrical Engineering from University of Washington in 2006. He is currently a Research Staff Member at IBM Thomas J. Watson Research Center in Yorktown Heights, NY. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including K-band, V-band and W-band phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including on-chip and off-chip interconnects. He has been involved in developing novel TSV and interposer technologies for heterogeneous system integration. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on technical program committees for MTT-S, ECTC, EPEPS, EDAPS and DesignCon.