T/R modules have traditionally used metal housings with glassed-in interconnects and ceramic substrates. More recent approaches use 3D stacked substrates and the tile module approach. This approach resulted in lower cost, lower-profile and lighter-weight arrays. With advances in packaging materials and processes, System In a Package (SIP) approaches are being used for T/R modules. These approaches promise the realization of further cost reductions, large "membrane" arrays for space applications and improved array-level manufacturability. This presentation reviews traditional T/R module packaging, examines a tile module in detail, examines next generation T/R modules using SIP and array-level packaging approaches. The presentation concludes with a projection on future developments in phased arrays.